• DocumentCode
    3070853
  • Title

    An IC for linearizing RF power amplifiers using envelope elimination and restoration

  • Author

    Su, D. ; McFarland, W.

  • Author_Institution
    Hewlett-Packard Labs., Palo Alto, CA, USA
  • fYear
    1998
  • fDate
    5-7 Feb. 1998
  • Firstpage
    54
  • Lastpage
    55
  • Abstract
    Efficient power amplifiers (PAs) are desirable because power amplifiers typically dominate the power consumed in portable radio devices. Cellular systems such as the advanced mobile phone system (AMPS) employ modulation schemes that generate constant amplitude RF outputs to use efficient but nonlinear PAs. Modern digital communication standards such as the North American dual-mode cellular (NADC) system require nonconstant amplitude RF outputs to maximize frequency spectral usage, and therefore require linear PAs. The traditional approach to linear RF power amplification is to back-off the output power of a PA until its distortion is reduced to an acceptable level. Power back-off can lead to significant reduction in output power and efficiency. The envelope elimination and restoration (EER) system is an alternative to power back-off, to simultaneously achieve efficiency and linearity in RF PAs.
  • Keywords
    UHF integrated circuits; UHF power amplifiers; cellular radio; digital radio; electric distortion; frequency allocation; telecommunication standards; North American dual-mode cellular system; UHF power amplifiers; advanced mobile phone system; cellular systems; constant amplitude RF outputs; digital communication standards; distortion; envelope elimination; frequency spectral usage; linearizing RF power amplifiers; modulation schemes; output power; portable radio devices; restoration; Amplitude modulation; Communication standards; Digital communication; Mobile handsets; Nonlinear distortion; Power amplifiers; Power generation; Radio frequency; Radiofrequency amplifiers; Radiofrequency integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 1998. Digest of Technical Papers. 1998 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-4344-1
  • Type

    conf

  • DOI
    10.1109/ISSCC.1998.672373
  • Filename
    672373