DocumentCode :
3070853
Title :
An IC for linearizing RF power amplifiers using envelope elimination and restoration
Author :
Su, D. ; McFarland, W.
Author_Institution :
Hewlett-Packard Labs., Palo Alto, CA, USA
fYear :
1998
fDate :
5-7 Feb. 1998
Firstpage :
54
Lastpage :
55
Abstract :
Efficient power amplifiers (PAs) are desirable because power amplifiers typically dominate the power consumed in portable radio devices. Cellular systems such as the advanced mobile phone system (AMPS) employ modulation schemes that generate constant amplitude RF outputs to use efficient but nonlinear PAs. Modern digital communication standards such as the North American dual-mode cellular (NADC) system require nonconstant amplitude RF outputs to maximize frequency spectral usage, and therefore require linear PAs. The traditional approach to linear RF power amplification is to back-off the output power of a PA until its distortion is reduced to an acceptable level. Power back-off can lead to significant reduction in output power and efficiency. The envelope elimination and restoration (EER) system is an alternative to power back-off, to simultaneously achieve efficiency and linearity in RF PAs.
Keywords :
UHF integrated circuits; UHF power amplifiers; cellular radio; digital radio; electric distortion; frequency allocation; telecommunication standards; North American dual-mode cellular system; UHF power amplifiers; advanced mobile phone system; cellular systems; constant amplitude RF outputs; digital communication standards; distortion; envelope elimination; frequency spectral usage; linearizing RF power amplifiers; modulation schemes; output power; portable radio devices; restoration; Amplitude modulation; Communication standards; Digital communication; Mobile handsets; Nonlinear distortion; Power amplifiers; Power generation; Radio frequency; Radiofrequency amplifiers; Radiofrequency integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 1998. Digest of Technical Papers. 1998 IEEE International
Conference_Location :
San Francisco, CA, USA
ISSN :
0193-6530
Print_ISBN :
0-7803-4344-1
Type :
conf
DOI :
10.1109/ISSCC.1998.672373
Filename :
672373
Link To Document :
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