Title :
Study of Plasma Induced Thin Oxide Damage During AlSiCu Etch
Author :
Liu, Lianjun ; Phua, G.H.J.
Keywords :
Annealing; Capacitors; Etching; Insulation; Manufacturing; Plasma applications; Plasma materials processing; Plasma measurements; Silicon; Very large scale integration;
Conference_Titel :
Plasma Process-Induced Damage, 1996 1st International Symposium on
Print_ISBN :
0-9651577-0-9
DOI :
10.1109/PPID.1996.715217