DocumentCode :
3071732
Title :
Study of Plasma Induced Thin Oxide Damage During AlSiCu Etch
Author :
Liu, Lianjun ; Phua, G.H.J.
fYear :
1996
fDate :
13-14 May 1996
Firstpage :
120
Lastpage :
123
Keywords :
Annealing; Capacitors; Etching; Insulation; Manufacturing; Plasma applications; Plasma materials processing; Plasma measurements; Silicon; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 1996 1st International Symposium on
Print_ISBN :
0-9651577-0-9
Type :
conf
DOI :
10.1109/PPID.1996.715217
Filename :
715217
Link To Document :
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