DocumentCode :
3072173
Title :
Inductive Damage and the Impact of RF Power and Magnetic Field During MERIE Processes
Author :
Salah, A. ; Awadelkarim, O.O. ; Chan, Y.D. ; Werking, J.
Author_Institution :
Pennsylvania State University
fYear :
1996
fDate :
13-14 May 1996
Firstpage :
131
Lastpage :
132
Keywords :
Coupling circuits; Etching; Integrated circuit interconnections; MOS devices; MOSFETs; Magnetic circuits; Magnetic fields; Magnetic materials; Plasma applications; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 1996 1st International Symposium on
Print_ISBN :
0-9651577-0-9
Type :
conf
DOI :
10.1109/PPID.1996.715220
Filename :
715220
Link To Document :
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