Title :
Slight Etching of Silicon to Control Post-RIE Damage
Author :
Hwang, D.K. ; Torek, K. ; Ruzyllo, J.
Author_Institution :
The Pennsylvania State University
Keywords :
Argon; Dry etching; Plasma applications; Plasma chemistry; Plasma devices; Plasma materials processing; Silicon; Surface cleaning; Surface contamination; Wet etching;
Conference_Titel :
Plasma Process-Induced Damage, 1996 1st International Symposium on
Conference_Location :
Santa Clara, CA, USA
Print_ISBN :
0-9651577-0-9
DOI :
10.1109/PPID.1996.715222
