DocumentCode
3072560
Title
Slight Etching of Silicon to Control Post-RIE Damage
Author
Hwang, D.K. ; Torek, K. ; Ruzyllo, J.
Author_Institution
The Pennsylvania State University
fYear
1996
fDate
14-14 May 1996
Firstpage
137
Lastpage
140
Keywords
Argon; Dry etching; Plasma applications; Plasma chemistry; Plasma devices; Plasma materials processing; Silicon; Surface cleaning; Surface contamination; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Process-Induced Damage, 1996 1st International Symposium on
Conference_Location
Santa Clara, CA, USA
Print_ISBN
0-9651577-0-9
Type
conf
DOI
10.1109/PPID.1996.715222
Filename
715222
Link To Document