Title :
Effect of Process & Etch Variables on Contact Resistance
Author :
MacPhie, A. ; Anderson, P. ; Boyd, G.
Author_Institution :
Motorola
Keywords :
Argon; Contact resistance; Dielectric films; Dielectric substrates; Dry etching; Plasma applications; Plasma chemistry; Resists; Silicon; Strips;
Conference_Titel :
Plasma Process-Induced Damage, 1996 1st International Symposium on
Print_ISBN :
0-9651577-0-9
DOI :
10.1109/PPID.1996.715223
