• DocumentCode
    3072786
  • Title

    InP substrate etched with methane reactive ion etching technique: surface characterization and epitaxial growth

  • Author

    Henry, L. ; Le Corre, A. ; Lecrosnier, D. ; Gauneau, M. ; Vaudry, C. ; Alnot, P. ; Olivier, J. ; Krawczyk, S.

  • Author_Institution
    CNET, Lannion, France
  • fYear
    1990
  • fDate
    23-25 April 1990
  • Firstpage
    234
  • Lastpage
    237
  • Abstract
    The authors have characterized the surface defects and determined the growth conditions that permit the fabrication of high-quality InP epitaxial layers. After etching, InP epitaxial layers have been grown by gas-source molecular beam epitaxy. The surface damage has been characterized by angle-resolved X-ray photoelectron spectroscopy, photoluminescence, and secondary ion mass spectroscopy. It has been found that reactive ion etching with methane, hydrogen, and argon mixtures induces a surface damaged layer that is phosphorus depleted and contains a high concentration of hydrogen atoms. Annealing under cracked phosphine restores the surface and permits the growing of high-quality InP epitaxial layers.<>
  • Keywords
    III-V semiconductors; X-ray photoelectron spectra; indium compounds; luminescence of inorganic solids; molecular beam epitaxial growth; photoluminescence; secondary ion mass spectra; semiconductor epitaxial layers; semiconductor growth; sputter etching; substrates; surface structure; H/sub 2/-Ar; InP substrate; angle-resolved X-ray photoelectron spectroscopy; annealing; cracked phosphine; epitaxial growth; epitaxial layers; gas-source molecular beam epitaxy; growth conditions; methane reactive ion etching; photoluminescence; secondary ion mass spectroscopy; surface damage; surface defects; Epitaxial layers; Etching; Fabrication; Hydrogen; Indium phosphide; Mass spectroscopy; Molecular beam epitaxial growth; Photoluminescence; Substrates; Surface cracks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1990. Second International Conference.
  • Conference_Location
    Denver, CO, USA
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1990.203024
  • Filename
    203024