Title :
Actual stresses around TSV in whole 3D-SiP under reflow or power ON/OFF thermal load
Author :
Kinoshita, T. ; Kawakami, Tomoya ; Wakamatsu, Takashi ; Shima, Shohei ; Matsumoto, Kaname ; Kohara, S. ; Yamada, Fumihiko ; Orii, Y.
Author_Institution :
Toyama Prefectural Univ., Imizu, Japan
Abstract :
In this study, simulations on the reflow process or the power ON/OFF thermal loads were performed with a large scale simulator based on FEM (Finite Element Method), ADVENTURECluster® to discuss actual stresses around TSV and brittle Si chip and to ensure the reliability of 3D SiP. Elasto-plastic condition was considered to Cu materials of TSVs, micro bumps and heat sink.
Keywords :
brittleness; elastoplasticity; finite element analysis; heat sinks; integrated circuit reliability; thermal management (packaging); three-dimensional integrated circuits; ADVENTURECluster; FEM; TSV; actual stresses; brittle silicon chip; elasto-plastic condition; finite element method; heat sink; large scale simulator; microbumps; power ON/OFF thermal load; reflow process; reliability; Heat sinks; Heat transfer; Silicon; Solid modeling; Stress; Thermal stresses; Through-silicon vias;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420223
