Title :
Experimental study on the performance of compact heat sink for LSI packages
Author :
Hatakeyama, T. ; Ishizuka, M. ; Kibushi, Risako
Author_Institution :
Mech. Syst. Eng., Toyama Prefectural Univ., Toyama, Japan
Abstract :
This paper describes experimental study about cooling performance of natural and forced air convection in compact heat sinks for LSI packages. Temperature rise of several heat sinks having different base areas, fin intervals and fin heights was measured. In natural convection case, the effect of supplied power on the temperature rise of the fin was examined. In forced convection case, correlations between air flow velocity and temperature rise were examined. Further, based on those results, non-dimensional expressions to evaluate cooling performance of compact heat sinks were proposed.
Keywords :
cooling; forced convection; heat measurement; heat sinks; integrated circuit packaging; large scale integration; natural convection; temperature; LSI package; air flow velocity; compact heat sink; cooling performance; fin height measurement; fin interval; forced air convection; natural air convection; temperature rise; Correlation; Heat sinks; Heat transfer; Heating; Large scale integration; Temperature measurement;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420225
