DocumentCode :
3073024
Title :
Room temperature debonding — An enabling technology for TSV and 3D integration
Author :
Matthias, T. ; Pauzenberger, G. ; Burggraf, Jurgen ; Burgstaller, Daniel ; Lindner, Philipp
Author_Institution :
EV Group, St. Florian am Inn, Austria
fYear :
2012
fDate :
24-26 Oct. 2012
Firstpage :
46
Lastpage :
48
Abstract :
ZoneBONDTM is a revolutionary breakthrough in thin wafer processing. It enables room temperature debonding method, which is independent from the properties of the temporary adhesive. Thereby it enables a standardization of the debonding process and debonding equipment as it is material independent. The ZoneBONDTM Open Platform enables a versatile supply chain with multiple adhesive suppliers.
Keywords :
integrated circuit interconnections; three-dimensional integrated circuits; wafer bonding; 3D integration; TSV; ZoneBOND; room temperature debonding; supply chain; thin wafer processing; Adhesives; Performance evaluation; Stacking; Temperature; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2012.6420231
Filename :
6420231
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3073024
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