Title :
A Multi-dimensional Iddq Testing Method Using Mahalanobis Distance
Author :
Nakamura, Yoshiyuki ; Tanaka, Masashi
Author_Institution :
Packaging & Test Technol. Div., Renesas Electron. Corp., Kawasaki, Japan
Abstract :
Iddq testing has been widely used to complement the fault coverage of functional testing. However, continual manufacturing process advances changed the situations. Even though delta-Iddq and many enhanced Iddq testing methods have been proposed in recent years, it is still difficult to identify the faulty chips from variations of good chips by simple one-dimensional analysis. In this paper, we propose Iddq testing using multi-dimensional analysis by using Mahalanobis distance to identify functional faulty product, and we evaluate our method by product data of over 100,000 chips.
Keywords :
integrated circuit testing; Mahalanobis distance; delta-Iddq; functional faulty product; functional testing; multidimensional Iddq testing method; Circuit faults; Delay; Fluctuations; Manufacturing processes; Semiconductor device measurement; Testing; Iddq testing; Mahalanobis distance; component;
Conference_Titel :
Defect and Fault Tolerance in VLSI Systems (DFT), 2010 IEEE 25th International Symposium on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-8447-8
DOI :
10.1109/DFT.2010.44
