DocumentCode
3073068
Title
A Multi-dimensional Iddq Testing Method Using Mahalanobis Distance
Author
Nakamura, Yoshiyuki ; Tanaka, Masashi
Author_Institution
Packaging & Test Technol. Div., Renesas Electron. Corp., Kawasaki, Japan
fYear
2010
fDate
6-8 Oct. 2010
Firstpage
303
Lastpage
309
Abstract
Iddq testing has been widely used to complement the fault coverage of functional testing. However, continual manufacturing process advances changed the situations. Even though delta-Iddq and many enhanced Iddq testing methods have been proposed in recent years, it is still difficult to identify the faulty chips from variations of good chips by simple one-dimensional analysis. In this paper, we propose Iddq testing using multi-dimensional analysis by using Mahalanobis distance to identify functional faulty product, and we evaluate our method by product data of over 100,000 chips.
Keywords
integrated circuit testing; Mahalanobis distance; delta-Iddq; functional faulty product; functional testing; multidimensional Iddq testing method; Circuit faults; Delay; Fluctuations; Manufacturing processes; Semiconductor device measurement; Testing; Iddq testing; Mahalanobis distance; component;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI Systems (DFT), 2010 IEEE 25th International Symposium on
Conference_Location
Kyoto
ISSN
1550-5774
Print_ISBN
978-1-4244-8447-8
Type
conf
DOI
10.1109/DFT.2010.44
Filename
5634918
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