Title :
Direct EP and direct EPAG — Novel surface finishes for gold-, copper wire bonding and soldering applications
Author_Institution :
Atotech Germany, Berlin, Germany
Abstract :
The direct deposition of palladium on copper is not a new surface finish process. Palladium was first introduced to the market as a surface finish on copper by Atotech more than 10 years ago. At that time, it was primarily used as a surface finish for soldering. In addition, it was employed as a contact surface in applications like touch key pads.
Keywords :
copper; gold; lead bonding; palladium; soldering; surface finishing; Atotech; Au; Cu; Pd; contact surface; copper; direct EPAG; gold; palladium; soldering; surface finish; wire bonding; Bonding; Copper; Gold; Nickel; Surface finishing; Wires;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420234
