DocumentCode :
3073114
Title :
Embedded power electronics for automotive applications
Author :
Ostmann, Andreas ; Hofmann, T. ; Neeb, Christoph ; Boettcher, Lars ; Manessis, Dionysios ; Lang, Klaus-Dieter
Author_Institution :
Fraunhofer IZM, Berlin, Germany
fYear :
2012
fDate :
24-26 Oct. 2012
Firstpage :
163
Lastpage :
166
Abstract :
The automotive industry has a strong demand for highly reliable and cost-efficient electronics. Especially the upcoming generations of hybrid cars and fully electrical vehicles need compact and efficient 400 V power modules. Within the engine compartment installation space is of major concern. Therefore small size and high integration level of the modules are needed. Conventionally IGBTs and diodes are soldered to DCB (Direct Copper Bond) ceramics substrates and their top contacts are connected by heavy Al wire bonds. These ceramic modules are vacuum soldered to water-cooled base plates. Embedding of power switches, and controller into compact modules using PCB (Printed Circuit Board) technologies offers the potential to further improve the thermal management by double-sided cooling and to reduce the thickness of the module. In a German funded project named “HI-LEVEL” partners from industry and research are developing a next generation of automotive power modules with embedded components. The final goal is a 50 kW inverter for hybrid electrical cars. In the paper the ongoing development and realization of a 10 kW test vehicle is described.
Keywords :
automotive electronics; ceramics; circuit reliability; embedded systems; hybrid electric vehicles; internal combustion engines; lead bonding; power electronics; printed circuit design; soldering; vacuum techniques; DCB; HI-LEVEL project; IGBT; PCB; automotive application; automotive industry; automotive power module; ceramic module; compact module; cost-efficient electronics; diode; direct copper bond ceramics substrate; double-sided cooling; electrical vehicle; embedded power electronics; engine compartment installation space; hybrid electrical car; power 10 kW; power 50 kW; power switch; printed circuit board; reliable electronics; thermal management; top contact; vacuum soldering; voltage 400 V; water-cooled base plate; wire bond; Automotive engineering; Insulated gate bipolar transistors; Multichip modules; Substrates; Thermal conductivity; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2012.6420235
Filename :
6420235
Link To Document :
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