• DocumentCode
    3073352
  • Title

    An In/sub 0.52/Al/sub 0.48/As/n/sup +/-In/sub x/Ga/sub 1-x/As heterostructure field-effect transistor with an In-enriched channel

  • Author

    Bahl, Sandeep ; Alamo, Jesús del

  • Author_Institution
    MIT, Cambridge, MA, USA
  • fYear
    1990
  • fDate
    23-25 April 1990
  • Firstpage
    100
  • Lastpage
    103
  • Abstract
    In/sub 0.52/Al/sub 0.48/As/n/sup +/-In/sub x/Ga/sub 1-x/As HFETs have been fabricated with InAs fractions between 0.53 and 0.7 in the channel. These HFETs, also called MIDFETs (metal-insulator doped-channel FETs), have a doped channel and an undoped wide-bandgap insulator. The enhancement of InAs in the channel results in a marked improvement in transconductance and peak drain current. Devices with L/sub g/=1 mu m and x=0.7 display an unprecedented I/sub d/ of 656 mA/mm and g/sub m/ of 296 mS/mm. As x is increased, however, there is an increase in the gate current, a dramatic decrease in the breakdown voltage, and a degradation of pinch-off. Leakage at the gate-mesa edge overlap is found to be partially responsible for these effects. To achieve the substantial gains in transport that higher InAs fractions offer, better isolation technology is required.<>
  • Keywords
    III-V semiconductors; aluminium compounds; gallium arsenide; indium compounds; insulated gate field effect transistors; 1 micron; 296 mS; HFETs; In-enriched channel; In/sub 0.52/Al/sub 0.48/As-In/sub x/Ga/sub 1-x/As; InP substrate; MIDFETs; breakdown voltage; gate current; gate length; gate-mesa edge overlap; heterostructure field-effect transistor; isolation technology; metal-insulator doped-channel FETs; peak drain current; pinch-off degradation; transconductance; undoped wide-bandgap insulator; Doping; Electrical resistance measurement; Electrons; FETs; HEMTs; Indium phosphide; Leakage current; MODFETs; Transconductance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1990. Second International Conference.
  • Conference_Location
    Denver, CO, USA
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1990.203065
  • Filename
    203065