Title :
The applications of wafer vacuum laminator equipment in 3D-IC process technology
Author :
Sheng-Yu Lin ; Ming-Tzung Chen ; Jeng-Ping Yang ; Pei-Wei Wang
Author_Institution :
CSUN Manuf. Ltd., Hsinchu, Taiwan
Abstract :
The technology of dry film laminator equipment has been developed in CSUN for more than a decade and widely adopted in PCB and Display industries.
Keywords :
printed circuits; three-dimensional integrated circuits; 3D-IC process technology; PCB; display industries; dry film laminator equipment; wafer vacuum laminator equipment; Compounds; Filling; Films; Lamination; Liquids; Resists; Through-silicon vias;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420250
