Title :
Temperature uniformity simulation of vapor chamber
Author :
Shung-Wen Kang ; Jun-Ying Lin ; Chun-Hsien Huang ; Yu-Tang Chen
Author_Institution :
Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Taipei, Taiwan
Abstract :
In this study, temperature uniformity and heating rate of multi-well vapor chambers of different materials were simulated and analyzed by CFD software at natural convection condition. Heat sources with a total heating power of 1200W were uniformly distributed to six 30×30mm2 rectangular vapor chambers for heating. Model size of the vapor chamber is 112×75×17.2mm, and its structure is consisted of upper plate and lower plate. The upper plate is 13.2mm thick, and has 173 holes with a diameter of 5mm and a depth of 10mm for each. The lower plate is rectangular with a thickness of 4mm. The vapor chambers are made of four main materials: copper, silver, aluminum and vapor chambers. Temperature uniformity is assessed by comparing highest temperature differences of vapor chambers. The simulation results showed that the vapor chamber has better temperature uniformity than other materials because it has higher heat content, slower heating rate and higher coefficient of heat conduction. Thus, vapor chambers are a better choice in selection of vapor chambers.
Keywords :
aluminium; copper; heat conduction; heat sinks; silver; Ag; Al; CFD software; Cu; heat conduction; heating rate; lower plate; multiwell vapor chambers; natural convection condition; power 1200 W; rectangular vapor chambers; size 13.2 mm; size 4 mm; size 5 mm; temperature uniformity simulation; upper plate; Aluminum; Copper; DNA; Heating; Materials; Silver; Standards; heating rate; temperature uniformity; vapor chamber;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420270