Title :
Analysis and design of MEMS RF probe
Author :
Hou-Jun Hsu ; Jung-Tang Huang ; Kuo-Yu Lee ; Ting-Chiang Tsai ; Chia-Hung Chou
Author_Institution :
Inst. of Mech. & Electr. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
Abstract :
Recently, there are many researches on the design of RF probes. Usually the materials of RF probe are tungsten and copper beryllium. They employed fabrication process of soldering and drawing of metal wire, which are not compatible with MEMS or IC fabrication process. Precise and high skill assembly is needed to finish the final probe module therefore results in high cost. This paper presents a novel RF probe module design which can be fabricated by Micro Electro Mechanical (MEM) fabrication process to reduce the cost. We use microwave simulation software, such as IE3D, Microwave Office, and Fidelity for design and analysis, and to know what kind of probe can reach the optimal impedance match and S-parameter. The design flow chart is coaxial cable to transform square coaxial cable, finally, in order to match up CPW standard pitches, therefore, design rectangular coaxial transition and success suitable ratio. Probe can match 50 Ω.
Keywords :
S-parameters; coaxial cables; microfabrication; micromechanical devices; probes; Fidelity; IC fabrication process; IE3D; MEMS RF probe; Microwave Office; S-parameter; design flow chart; final probe module; metal wire; micro electro mechanical fabrication process; microwave simulation software; optimal impedance match; rectangular coaxial transition; soldering; square coaxial cable; Coplanar waveguides; Fabrication; Metals; Power transmission lines; Probes; Radio frequency; Transmission line measurements;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420276