• DocumentCode
    3073823
  • Title

    Analysis and design of MEMS RF probe

  • Author

    Hou-Jun Hsu ; Jung-Tang Huang ; Kuo-Yu Lee ; Ting-Chiang Tsai ; Chia-Hung Chou

  • Author_Institution
    Inst. of Mech. & Electr. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
  • fYear
    2012
  • fDate
    24-26 Oct. 2012
  • Firstpage
    373
  • Lastpage
    379
  • Abstract
    Recently, there are many researches on the design of RF probes. Usually the materials of RF probe are tungsten and copper beryllium. They employed fabrication process of soldering and drawing of metal wire, which are not compatible with MEMS or IC fabrication process. Precise and high skill assembly is needed to finish the final probe module therefore results in high cost. This paper presents a novel RF probe module design which can be fabricated by Micro Electro Mechanical (MEM) fabrication process to reduce the cost. We use microwave simulation software, such as IE3D, Microwave Office, and Fidelity for design and analysis, and to know what kind of probe can reach the optimal impedance match and S-parameter. The design flow chart is coaxial cable to transform square coaxial cable, finally, in order to match up CPW standard pitches, therefore, design rectangular coaxial transition and success suitable ratio. Probe can match 50 Ω.
  • Keywords
    S-parameters; coaxial cables; microfabrication; micromechanical devices; probes; Fidelity; IC fabrication process; IE3D; MEMS RF probe; Microwave Office; S-parameter; design flow chart; final probe module; metal wire; micro electro mechanical fabrication process; microwave simulation software; optimal impedance match; rectangular coaxial transition; soldering; square coaxial cable; Coplanar waveguides; Fabrication; Metals; Power transmission lines; Probes; Radio frequency; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4673-1635-4
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2012.6420276
  • Filename
    6420276