Title :
Creep Corrosion occurrence on TQFP IC package
Author_Institution :
Integrated Service Technol., Inc., Hsinchu, Taiwan
Abstract :
Creep Corrosion is the common factor to cause electronic products failed. Cloud Computing is getting more and more popular in recent years so people´s daily life correlate closely to Cloud Computing. Many global companies built the huge data center in different countries. The challenges Cloud Computing facing are Transmission Technology, Cooling System, Energy Consumption and Air Pollution. Also, Creep Corrosion is a big concern to Cloud Computing. In this study, creep corrosion occurrence on IC Package is investigated.
Keywords :
cloud computing; corrosion; creep; electronics packaging; TQFP IC package; air pollution; cloud computing; cooling system; creep corrosion occurrence; electronic products; energy consumption; transmission technology; Cloud computing; Copper; Corrosion; Creep; Integrated circuits; Lead; Tin; 3D OM; Creep Corrosion; Mixed Flowing Gas Test (MFG); Organic Acid Flux; Rosin Flux; SEM/EDX; X-Section;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420283
