DocumentCode :
3074084
Title :
Interconnect discussion group summary, IRW 2004
Author :
Baozhen Li ; Girault, V.
fYear :
2004
fDate :
18-21 Oct. 2004
Firstpage :
192
Lastpage :
192
Keywords :
Adhesives; Aluminum; Conductivity; Copper; Dielectrics; Electromigration; Integrated circuit interconnections; Microelectronics; Testing; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2004 IEEE International
Print_ISBN :
0-7803-8517-9
Type :
conf
DOI :
10.1109/IRWS.2004.1422774
Filename :
1422774
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3074084
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