Title :
Next generation electroplating technology for high planarity, minimum surface deposition microvia filling
Author :
Ming-Yao Yen ; Ming-Hung Chiang ; Hsu-Hsin Tai ; Hsien-Chang Chen ; Kwok-Wai Yee ; Li, Cong ; Lefebvre, M. ; Bayes, M.
Author_Institution :
Dow Electron. Mater., Dow Chem. Co., Taoyuan Hsien, Taiwan
Abstract :
The combination of specialized equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling. A new, insoluble anode, DC microvia fill system is now available for high volume manufacturing (HVM), offering additional operating flexibility and end user preference.
Keywords :
copper; electroplating; integrated circuit packaging; vias; DC microvia filling; HVM; IC package substrate; electrolytic copper microvia filling; high volume manufacturing; insoluble anode; next generation electroplating technology surface deposition; Anodes; Copper; Current density; Filling; Production; Substrates; Surface treatment;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420290
