Title :
Electroplating through holes with different geometry -- A novel and high productivity process for through hole fill plating
Author :
Najjar, Elie ; Barstad, L. ; Nagarajan, J. ; Lin, Man ; Rzeznik, M. ; Lefebvre, M.
Author_Institution :
Dow Electron. Mater., Dow Chem. Co., Marlborough, MA, USA
Abstract :
A novel DC through hole filling process was formulated for high volume HDI and substrate core layer metallization production. The process yields high quality results over a wide current density range.
Keywords :
electroplating; metallisation; printed circuit interconnections; DC through hole filling process; electroplating; high productivity process; high volume HDI; substrate core layer metallization production; through hole fill plating; Additives; Chemistry; Copper; Current density; Filling; Reliability; Substrates;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012 7th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1635-4
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2012.6420311
