DocumentCode
3074729
Title
Finding cool code: An analysis of source-level causes of temperature effects
Author
Upton, Dan ; Hazelwood, Kim
Author_Institution
Dept. of Comput. Sci., Univ. of Virginia, Charlottesville, VA, USA
fYear
2011
fDate
10-12 April 2011
Firstpage
117
Lastpage
118
Abstract
This work discussed how source and microarchitectural level characteristics correlate with processor temperature. The first look is at correlations between phase changes and temperature changes, which shows that the relationship between phases and temperature are consistent across architectures but that code selection by the compiler can have an impact on phase lengths and temperature behaviors. Understanding temperature behaviors at the application level can lead to hints for thermal management or allow the developer to write code with thermal management in mind.
Keywords
microprocessor chips; program compilers; temperature; thermal management (packaging); code selection; microarchitectural level characteristics; phase change; phase length; processor temperature; source level cause; temperature change; temperature effect; thermal management; Correlation; Hardware; Microarchitecture; Processor scheduling; Temperature; Temperature control; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Performance Analysis of Systems and Software (ISPASS), 2011 IEEE International Symposium on
Conference_Location
Austin, TX
Print_ISBN
978-1-61284-367-4
Electronic_ISBN
978-1-61284-368-1
Type
conf
DOI
10.1109/ISPASS.2011.5762721
Filename
5762721
Link To Document