Materials characterization, conduction development, and curing-effects on reliability of isotropically conductive adhesives

Author

Klosterman, Don ; Li, Li ; Morris, J.E.

Author_Institution

Motorola Corp., USA

fYear

1996

fDate

28-31 May 1996

Firstpage

571

Lastpage

577

Abstract

Three commercially available, silver filled, snap cure isotropically electrically conductive adhesives for surface mount applications were selected for study. Fundamental material characterizations were conducted on these materials, including thermal analysis (DSC, TGA, and TMA), rheological, and dynamic mechanical analyses. Microstructural investigations (SEM, TEM, Auger) were performed to identify the silver flake size, distribution, and contact morphology. These analyses were related to the cure process and electrical conduction mechanisms of ICAs

Keywords

Auger effect; conducting polymers; electrical conductivity; filled polymers; lead bonding; microassembling; reliability; scanning electron microscopy; silver; surface mount technology; thermal analysis; transmission electron microscopy; Ag filled adhesive; Ag flake distribution; Ag flake size; DSC; SEM; TEM; TGA; TMA; conduction development; contact morphology; curing effects; dynamic mechanical analysis; electrical conduction mechanisms; isotropically conductive adhesives; materials characterization; microstructural investigations; reliability; rheological analysis; snap cure adhesive; surface mount applications; thermal analysis; Conducting materials; Conductive adhesives; Conductivity; Copper; Curing; Electric resistance; Independent component analysis; Job shop scheduling; Materials reliability; Silver;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.551418

Filename

551418