Title :
Flip chip bonding using isotropically conductive adhesives
Author :
Rösner, Bela ; Liu, Johan ; Lai, Zonghe
Author_Institution :
Thomson Multimedia, Villingen, Switzerland
Abstract :
In this paper results of investigations concerning the reliability of adhesive bumps are presented. These bumps interconnect test flip chips with different sizes to both Al2O3 and FR4 substrates. The samples have been exposed to thermal cycling. The transition resistance of the bumps [TRR], and the resistance of daisy chains as criteria of the interconnection´s quality, have been measured at different time instances of the environmental stress. Ag migration investigations were also carried out. This study shows that there is no reliable adhesive bump interconnection without the use of underfill material
Keywords :
adhesion; conducting polymers; filled polymers; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; lead bonding; Ag migration; Al2O3; Al2O3 substrates; FR4 substrates; adhesive bump reliability; daisy chains; environmental stress; flip chip bonding; interconnection quality; isotropically conductive adhesives; thermal cycling; transition resistance; underfill material; Bonding; Conductive adhesives; Electrical resistance measurement; Flip chip; Materials reliability; Semiconductor device measurement; Stress measurement; Testing; Thermal stresses; Time measurement;
Conference_Titel :
Electronic Components and Technology Conference, 1996. Proceedings., 46th
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3286-5
DOI :
10.1109/ECTC.1996.551419
