• DocumentCode
    3077800
  • Title

    Study of electric field enhancement along polymer insulators under service conditions

  • Author

    Souza, Ailton Lopes ; da Silva Lopes, Ivan Jose

  • Author_Institution
    Electr. Eng. Dept., Fed. Univ. of Minas Gerais, Belo Horizonte, Brazil
  • fYear
    2010
  • fDate
    8-10 Nov. 2010
  • Firstpage
    759
  • Lastpage
    764
  • Abstract
    In recent years, the concerns about premature failures of polymer insulators have been increasing. These failures, in part, can be attributed to the high electric field (E-field) magnitude at end fittings of these insulators, which may lead to partial discharges activity. The E-field values recommended by manufacturers and researchers, to avoid this phenomenon, are not fully consensual yet, particularly when considering the insulator under service conditions, because the E-field can be affected by several factors. This paper analyzes the E-field along polymer insulators through computational simulations using finite element method to model the insulator and water drops. In association with the simulations laboratory, experiments were performed, where the corona voltage inception was observed. The experiments were made to reproduce moisture conditions on the insulator surface. The results clearly show how certain service conditions may increase the E-field.
  • Keywords
    corona; electric fields; finite element analysis; partial discharges; polymer insulators; E-field; corona voltage inception; electric field enhancement; finite element method; partial discharge activity; polymer insulator; service condition; water drop; Computational modeling; Corona; Insulators; Partial discharges; Polymers; Sensors; Surface discharges; Corona Onset Voltage; Electric Field; Polymer Insulator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission and Distribution Conference and Exposition: Latin America (T&D-LA), 2010 IEEE/PES
  • Conference_Location
    Sao Paulo
  • Print_ISBN
    978-1-4577-0488-8
  • Type

    conf

  • DOI
    10.1109/TDC-LA.2010.5762969
  • Filename
    5762969