DocumentCode :
3078030
Title :
Analysis of thermal effects on crosstalk and performance of optoelectronic transmitter modules
Author :
Ukaegbu, Ikechi Augustine ; Sangirov, Jamshid ; Lee, Tae-Woo ; Cho, Mu Hee ; Park, Hyo-Hoon
Author_Institution :
Electr. Eng. Dept., KAIST, Daejeon, South Korea
fYear :
2012
fDate :
2-6 July 2012
Firstpage :
537
Lastpage :
538
Abstract :
In this work, an analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic modules for reliable data transmission.
Keywords :
electronics packaging; optical crosstalk; optical interconnections; optical transmitters; optoelectronic devices; crosstalk; data transmission; interconnect parameters; multichannel optoelectronic modules; optoelectronic transmitter modules; packaging; thermal critical frequency; thermal effects; Crosstalk; Optical crosstalk; Optical interconnections; Optical transmitters; Reliability; Thermal analysis; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Opto-Electronics and Communications Conference (OECC), 2012 17th
Conference_Location :
Busan
ISSN :
2166-8884
Print_ISBN :
978-1-4673-0976-9
Electronic_ISBN :
2166-8884
Type :
conf
DOI :
10.1109/OECC.2012.6276560
Filename :
6276560
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3078030
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