DocumentCode :
3079373
Title :
Improvement of needle type applicator made of shape memory alloy
Author :
Kanazawa, Y. ; Kato, K. ; Yabuhara, T. ; Uzuka, T. ; Takahashi, H. ; Fujii, Y.
Author_Institution :
Department of Mechanical Engineering Informatics, Meiji University, Kawasaki, Japan
fYear :
2008
fDate :
20-25 Aug. 2008
Firstpage :
4372
Lastpage :
4375
Abstract :
This paper discusses radio frequency (RF) interstitial hyperthermia for brain tumors with a developed needle type applicator made of a shape memory alloy (SMA). The problem with the heating method of interstitial hyperthermia is the small heating area. So, we proposed a new heating method using a needle type electrode made of SMA which consists of nickel (Ni), copper (Cu) and titanium (Ti) for expanding the heating area. Here, we proposed the heating method that the leading end of needle type electrode was divided into four parts and the leading end spreads in four directions with a temperature rise. First, the proposed RF interstitial hyperthermia system with the SMA needle was presented. Second, the results obtained by the experimental heating of the agar phantom by using the developed SMA needle type applicator were presented. Third, comparing experimental results, we discussed the heating properties of the developed system. Finally, from these results, it is confirmed that the developed needle type applicator made of SMA is useful for wide heating by invasive hyperthermia.
Keywords :
Applicators; Copper; Electrodes; Heating; Hyperthermia; Needles; Neoplasms; Nickel; Radio frequency; Shape memory alloys; Hyperthermia; Needle type applicator; Shape memory alloy; Temperature distribution; Algorithms; Alloys; Brain Neoplasms; Electrodes; Equipment Design; Humans; Hyperthermia, Induced; Materials Testing; Needles; Phantoms, Imaging; Signal Processing, Computer-Assisted; Software; Temperature; Transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
Conference_Location :
Vancouver, BC
ISSN :
1557-170X
Print_ISBN :
978-1-4244-1814-5
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2008.4650179
Filename :
4650179
Link To Document :
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