Title :
Worst-case temperature analysis for real-time systems
Author :
Rai, Devendra ; Yang, Hoeseok ; Bacivarov, Iuliana ; Chen, Jian-Jia ; Thiele, Lothar
Author_Institution :
ETH Zurich, Zurich, Switzerland
Abstract :
With the evolution of today´s semiconductor technology, chip temperature increases rapidly mainly due to the growth in power density. For modern embedded real-time systems, it is crucial to estimate maximal temperatures in order to take mapping or other design decisions to avoid burnout, and still be able to guarantee meeting real-time constraints. This paper provides answers to the question: When work-conserving scheduling algorithms, such as earliest-deadline-first (EDF), rate-monotonie (RM), deadline-monotonic (DM), are applied, what is the worst-case peak temperature of a real-time embedded system under all possible scenarios of task executions? We propose an analytic framework, which considers a general event model based on network and real-time calculus. This analysis framework has the capability to handle a broad range of uncertainties in terms of task execution times, task invocation periods, and jitter in task arrivals. Simulations show that our framework is a cornerstone to design real-time systems that have guarantees on both schedulability and maximal temperatures.
Keywords :
calculus; embedded systems; microprocessor chips; scheduling; chip temperature; deadline-monotonic scheduling algorithm; earliest-deadline-first scheduling algorithm; embedded realtime systems; network calculus; rate-monotonie scheduling algorithm; realtime calculus; semiconductor technology; task arrival jitter; task execution time; task invocation period; worst-case temperature analysis; Calculus; Jitter; Real time systems; Thermal analysis; Thermal management; Timing; Upper bound; compositional analysis; real-time systems; thermal analysis; worst-case peak temperature;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011
Conference_Location :
Grenoble
Print_ISBN :
978-1-61284-208-0
DOI :
10.1109/DATE.2011.5763104