DocumentCode :
3080844
Title :
Simple study on resisting EMI of the Print circuit board in the secondary equipments of HVDC
Author :
Rui Lin ; Zhang, Weidong ; Cui, Xiang ; Zhang, Hui
Author_Institution :
Sch. of Electr. & Electron. Eng., North China Electr. Power Univ., Baoding, China
fYear :
2008
fDate :
10-13 Dec. 2008
Firstpage :
1
Lastpage :
4
Abstract :
The electromagnetic environment of the high voltage direct current (HVDC) is much more complex than ever. The electromagnetic compatibility (EMC) of the printed circuit board (PCB) in the secondary equipments is the top priority. In this paper, finite integration theory (FIT) methods are applied to analyse the resisting electro magnetic interference (EMI) of the PCB in high frequency. The model bases of the real object of secondary equipment are put forward. Two directions of incident wave propagation at 0-2 GHz is simulated, the induction voltage, electric field, magnetic field intensity and surface current at the loop are analysed. The simulation results show that if the field conditions lead more than 2 GHz incident wave, the electric field intensity may be higher enough to make the devices out of work, the shielded enclosure on microchip is needed in this situation.
Keywords :
HVDC power transmission; electromagnetic compatibility; printed circuits; EMI resistance; HVDC transmission secondary equipments; electric field intensity; electromagnetic compatibility; finite integration theory methods; frequency 0 GHz to 2 GHz; incident wave propagation direction; induction voltage analysis; loop surface current analysis; magnetic field intensity; print circuit board; Analytical models; Electromagnetic compatibility; Electromagnetic interference; Frequency; HVDC transmission; Magnetic analysis; Magnetic shielding; Printed circuits; Surface waves; Voltage; EMI; HVDC; PCB; induction voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electricity Distribution, 2008. CICED 2008. China International Conference on
Conference_Location :
Guangzhou
Print_ISBN :
978-1-4244-3373-5
Electronic_ISBN :
978-1-4244-3372-8
Type :
conf
DOI :
10.1109/CICED.2008.5211663
Filename :
5211663
Link To Document :
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