• DocumentCode
    3081324
  • Title

    On the efficacy of NBTI mitigation techniques

  • Author

    Chan, Tuck-Boon ; Sartori, John ; Gupta, Puneet ; Kumar, Rakesh

  • Author_Institution
    ECE Dept, Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2011
  • fDate
    14-18 March 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Negative Bias Temperature Instability (NBTI) has become an important reliability issue in modern semiconductor processes. Recent work has attempted to address NBTI-induced degradation at the architecture level. However, such work has relied on device-level analytical models that, we argue, are limited in their flexibility to model the impact of architecture-level techniques on NBTI degradation. In this paper, we propose a flexible numerical model for NBTI degradation that can be adapted to better estimate the impact of architecture-level techniques on NBTI degradation. Our model is a numerical solution to the reaction-diffusion equations describing NBTI degradation that has been parameterized to model the impact of dynamic voltage scaling, averaging effects across logic paths, power gating, and activity management We use this model to understand the effectiveness of different classes of architecture-level techniques that have been proposed to mitigate the effects of NBTI. We show that the potential benefits from these techniques are, for the most part, smaller than what has been previously suggested, and that guardbanding may still be an efficient way to deal with aging.
  • Keywords
    semiconductor device models; semiconductor device reliability; NBTI degradation; NBTI mitigation; architecture-level techniques; device level analytical models; negative bias temperature instability; reaction-diffusion equations; reliability; semiconductor processes; Aging; Degradation; Equations; Mathematical model; Numerical models; Stress; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011
  • Conference_Location
    Grenoble
  • ISSN
    1530-1591
  • Print_ISBN
    978-1-61284-208-0
  • Type

    conf

  • DOI
    10.1109/DATE.2011.5763151
  • Filename
    5763151