• DocumentCode
    3082261
  • Title

    A hybrid particle swarm optimization for component placement in 3D IC design

  • Author

    Tuan Anh To ; Dang Anh Tuan ; Vo Chi Thanh ; Siddiqi, Umair F. ; Shiraishi, Yasuyuki ; Motegi, Kazuhiro

  • Author_Institution
    Dept. of Production Sci. & Technol., Gunma Univ., Ohta, Japan
  • fYear
    2013
  • fDate
    12-15 Dec. 2013
  • Firstpage
    68
  • Lastpage
    71
  • Abstract
    This paper deals with a component placement algorithm for 3D IC design. The Particle Swarm Optimization (PSO) is a general purpose stochastic algorithm mimicking the behaviors of particles self-organizing a system. The size of solution space is very large in the 3D component placement problem and it is afraid that the objective function value will be degraded. The Clustering Algorithm (CA) is an efficient initial placement algorithm and this algorithm is used for partitioning the placement problem into clusters with the total pseudo wire-length minimization. PSO is applied to each of the clusters for determining the detailed placement of components with the acceleration as well as the objective function optimization. This hybrid PSO (CA-PSO) is experimentally evaluated against a component placement problem of actual printed wiring board consisting of 217 components and 462 nets and the results show its feasibility.
  • Keywords
    circuit optimisation; integrated circuit design; minimisation; particle swarm optimisation; pattern clustering; three-dimensional integrated circuits; 3D IC design; 3D component placement algorithm; CA; CA-PSO; PSO; clustering algorithm; general purpose stochastic algorithm; hybrid particle swarm optimization; initial placement algorithm; objective function optimization; particle self-organizing behaviors; printed wiring board; pseudowire-length minimization; Algorithm design and analysis; Clustering algorithms; Layout; Linear programming; Optimization; Particle swarm optimization; Three-dimensional displays; 3 dimension; IC; PSO; System on Package; algorithm; clustering; design; hybrid; placement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
  • Conference_Location
    Nara
  • Print_ISBN
    978-1-4799-2313-7
  • Type

    conf

  • DOI
    10.1109/EDAPS.2013.6724391
  • Filename
    6724391