DocumentCode
3082261
Title
A hybrid particle swarm optimization for component placement in 3D IC design
Author
Tuan Anh To ; Dang Anh Tuan ; Vo Chi Thanh ; Siddiqi, Umair F. ; Shiraishi, Yasuyuki ; Motegi, Kazuhiro
Author_Institution
Dept. of Production Sci. & Technol., Gunma Univ., Ohta, Japan
fYear
2013
fDate
12-15 Dec. 2013
Firstpage
68
Lastpage
71
Abstract
This paper deals with a component placement algorithm for 3D IC design. The Particle Swarm Optimization (PSO) is a general purpose stochastic algorithm mimicking the behaviors of particles self-organizing a system. The size of solution space is very large in the 3D component placement problem and it is afraid that the objective function value will be degraded. The Clustering Algorithm (CA) is an efficient initial placement algorithm and this algorithm is used for partitioning the placement problem into clusters with the total pseudo wire-length minimization. PSO is applied to each of the clusters for determining the detailed placement of components with the acceleration as well as the objective function optimization. This hybrid PSO (CA-PSO) is experimentally evaluated against a component placement problem of actual printed wiring board consisting of 217 components and 462 nets and the results show its feasibility.
Keywords
circuit optimisation; integrated circuit design; minimisation; particle swarm optimisation; pattern clustering; three-dimensional integrated circuits; 3D IC design; 3D component placement algorithm; CA; CA-PSO; PSO; clustering algorithm; general purpose stochastic algorithm; hybrid particle swarm optimization; initial placement algorithm; objective function optimization; particle self-organizing behaviors; printed wiring board; pseudowire-length minimization; Algorithm design and analysis; Clustering algorithms; Layout; Linear programming; Optimization; Particle swarm optimization; Three-dimensional displays; 3 dimension; IC; PSO; System on Package; algorithm; clustering; design; hybrid; placement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location
Nara
Print_ISBN
978-1-4799-2313-7
Type
conf
DOI
10.1109/EDAPS.2013.6724391
Filename
6724391
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