Title :
Thermal analysis of a cooling module for an image sensor with thermally isolated pixel area
Author :
Kamehama, Hiroki ; Yasutomi, Keita ; Kagawa, Keiichiro ; Kawahito, S.
Author_Institution :
Grad. Sch. of Sci. & Technol., Shizuoka Univ., Hamamatsu, Japan
Abstract :
This paper describes a new method of small-size and low-power consumption cooling for decreasing dark current of image sensors. The image sensor has a thermal isolation structure between pixel area and readout circuits. The small-size and low-power cooling module can be realized by this structure with a small current Peltier module. The cooling effect of this structure with the Peltier module is investigated with thermal simulation.
Keywords :
Peltier effect; cooling; image sensors; low-power electronics; thermal analysis; cooling effect; dark current; image sensor; low-power consumption cooling; low-power cooling module; readout circuits; small current Peltier module; thermal analysis; thermal isolation structure; thermal simulation; thermally isolated pixel area; CMOS image sensors; Cooling; Temperature sensors; Thermal conductivity; Thermal resistance; CMOS Image Sensor; Peltier; Thermally isolated;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara
Print_ISBN :
978-1-4799-2313-7
DOI :
10.1109/EDAPS.2013.6724409
