Title :
Suppression of conducted noise coupling in a board with digital and RF circuits by a ferrite film plated on an interposer
Author :
Iwanami, M. ; Kushta, Taras ; Tsukamoto, Kazuya ; Kondo, K.
Author_Institution :
NEC Corp., Kawasaki, Japan
Abstract :
This paper presents evaluation results of conducted noise suppression effect of a ferrite film directly plated on an interposer substrate in the long-term evolution (LTE) communication band. A test board for evaluations has an IC with digital and RF circuits which is designed for investigations of electromagnetic noise coupling at the IC chip level. Firstly, we have confirmed effectiveness of a ferrite film onto an interposer in suppression of conducted noise from a digital circuit to a board by simulations. Then, we have verified that the ferrite film reduces conducted noise coupling to the RF circuit, occurring inside the board, by measurements of In-phase/Quadrature (I/Q) signals and high frequency voltages of power supply lines.
Keywords :
digital integrated circuits; electromagnetic coupling; ferrites; integrated circuit packaging; interference suppression; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; I-Q signals; IC chip level; LTE communication band; RF circuits; conducted noise suppression effect; digital circuits; electromagnetic noise coupling; ferrite film; high frequency voltages; inphase-quadrature signals; interposer substrate; long-term evolution communication band; power supply lines; test board; Couplings; Ferrite films; Integrated circuits; Mathematical model; Noise; Q measurement; Radio frequency; I/Q signal; conducted noise coupling; ferrite film; interposer;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
Conference_Location :
Nara
Print_ISBN :
978-1-4799-2313-7
DOI :
10.1109/EDAPS.2013.6724427
