• DocumentCode
    3083578
  • Title

    Compact parameterized macromodels for signal and power integrity analysis of RF and mixed signal systems

  • Author

    Grivet-Talocia, Stefano ; Olivadese, Salvatore Bernardo ; Signorini, Gianni ; Brenner, Pietro

  • fYear
    2013
  • fDate
    12-15 Dec. 2013
  • Firstpage
    40
  • Lastpage
    43
  • Abstract
    Linear macromodeling techniques are well established for compact dynamical modeling of complex signal and power distribution networks. In this work, we extend applicability of such reduced-order behavioral models to small-signal descriptions of complex circuit blocks typically found in RF or Analog and Mixed/Signal designs. In addition, we include in the models the explicit dependence on one or more design parameters, such as temperature, bias or gain, thus obtaining a multivariate small-signal behavioral macromodeling approach. The main outcome is a major reduction in the runtime required for transient system-level verification, which can be performed directly by simulating the surrogate macromodels rather than full transistor-level circuits. We demonstrate this approach through an Operarional Amplifier circuit block of a commercial 3G transceiver design.
  • Keywords
    3G mobile communication; distribution networks; mixed analogue-digital integrated circuits; operational amplifiers; radio transceivers; 3G transceiver design; RF designs; RF systems; analog designs; compact parameterized macromodels; complex circuit blocks; linear macromodeling techniques; mixed signal systems; mixed/signal designs; operational amplifier circuit block; power distribution networks; power integrity analysis; reduced-order behavioral models; signal analysis; transient system-level verification; transistor-level circuits; Integrated circuit interconnections; Integrated circuit modeling; Nonlinear circuits; Polynomials; Radio frequency; Solid modeling; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2013 IEEE
  • Conference_Location
    Nara
  • Print_ISBN
    978-1-4799-2313-7
  • Type

    conf

  • DOI
    10.1109/EDAPS.2013.6724452
  • Filename
    6724452