DocumentCode :
3084294
Title :
Early chip planning cockpit
Author :
Shin, Jeonghee ; Darringer, John A. ; Luo, Guojie ; Weger, Alan J. ; Johnson, Charles L.
Author_Institution :
IBM T. J. Watson Res., Yorktown Heights, NY, USA
fYear :
2011
fDate :
14-18 March 2011
Firstpage :
1
Lastpage :
4
Abstract :
The design of high-performance servers has always been a challenging art. Now, server designers are being asked to explore a much larger design space as they consider multicore heterogeneous architecture and the limits of advancing silicon technology. Bringing automation to the early stages of design can enable more rapid and accurate trade-off analysis. In this paper, we introduce an Early Chip Planner which allows designers to rapidly analyze microarchitecture, physical and package design trade-offs for 2D and 3D VLSI chips and generates an attributed netlist to be carried on to the implementation stage. We also describe its use in planning a 3D special-purpose server processor.
Keywords :
VLSI; microprocessor chips; multiprocessing systems; VLSI chips; early chip planning cockpit; microarchitecture; server processor; silicon technology; Chip scale packaging; Microarchitecture; Planning; Servers; Thermal analysis; Three dimensional displays; Through-silicon vias; early chip planning; system level design automation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011
Conference_Location :
Grenoble
ISSN :
1530-1591
Print_ISBN :
978-1-61284-208-0
Type :
conf
DOI :
10.1109/DATE.2011.5763292
Filename :
5763292
Link To Document :
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