Title :
Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247)
Abstract :
The following topics were dealt with: interconnects; reliability; dielectric materials; IC modelling; CMP; dual damascene structure; Al technology; high frequency applications; salicides; and deposition processes
Keywords :
chemical mechanical polishing; dielectric thin films; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; integrated circuit reliability; CMP; IC modelling; deposition processes; dielectric materials; dual damascene structure; high frequency applications; interconnects; reliability; salicides;
Conference_Titel :
Interconnect Technology, 1999. IEEE International Conference
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-5174-6
DOI :
10.1109/IITC.1999.787059
