Title :
High frequency modeling of interconnects in deep-submicron technologies
Author :
Cregut, Corinne ; Le Carval, Gilles ; Chilo, Jean
Author_Institution :
SNAKETECH, Voiron, France
Abstract :
In this paper, we evaluate the suitable level of modeling for interconnects in deep sub-micron circuits. We propose high frequency models for transmission lines and crosstalk. Our method is based on the association of electromagnetic (EM) and electrical simulations. We validate the principle of this method by comparisons with time domain characterizations. In particular, we analyze the role of the ground configuration in the mechanisms of crosstalk
Keywords :
MMIC; crosstalk; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; transmission line theory; EM simulations; crosstalk; crosstalk mechanisms; electrical simulations; electromagnetic simulations; ground configuration; high frequency modeling; high frequency models; interconnect modeling; interconnects; time domain characterization; transmission lines; Circuit simulation; Circuit testing; Computational modeling; Crosstalk; Dielectric substrates; Distributed parameter circuits; Frequency; Integrated circuit interconnections; RLC circuits; Transmission line measurements;
Conference_Titel :
Interconnect Technology, 1999. IEEE International Conference
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5174-6
DOI :
10.1109/IITC.1999.787082
