DocumentCode :
3085303
Title :
Device effect of low energy implantation in high density plasma
Author :
Wu, Hanming ; Lee, Scott ; Yu, Xing ; Liu, Yong ; Chen, John
Author_Institution :
Semicond. Manuf. Int. Corp., Shanghai, China
fYear :
2004
fDate :
15-16 March 2004
Firstpage :
35
Lastpage :
38
Abstract :
In the present paper, high-density plasma implantation is proposed for shallow junction formation. The inevitable low energy component in ion energy distribution function (IEDF) has been studied by theoretical and numerical methods. Finally, the device effects induced by such a low energy component in IEDF in plasma implantation are analyzed and discussed.
Keywords :
ion implantation; plasma materials processing; semiconductor doping; device effect; high density plasma; ion energy distribution function; low energy component; low energy implantation; plasma implantation; Annealing; Distribution functions; Implants; Plasma applications; Plasma density; Plasma devices; Plasma materials processing; Plasma sources; Semiconductor device manufacture; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2004. IWJT '04. The Fourth International Workshop on
Print_ISBN :
0-7803-8191-2
Type :
conf
DOI :
10.1109/IWJT.2004.1306752
Filename :
1306752
Link To Document :
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