• DocumentCode
    3085410
  • Title

    Biologically inspired microtexturing: Investigation into the surface topography of next-generation neurosurgical probes

  • Author

    Frasson, L. ; Parittotokkaporn, T. ; Schneider, A. ; Davies, B.L. ; Vincent, J.F.V. ; Huq, S.E. ; Degenaar, P. ; Baena, F.M.Rodriguez

  • Author_Institution
    Faculty of Engineering, Imperial College London, SW7 2AZ, UK
  • fYear
    2008
  • fDate
    20-25 Aug. 2008
  • Firstpage
    5611
  • Lastpage
    5614
  • Abstract
    Minimally Invasive (MI) surgery represents the future of many types of medical intervention (keyhole neurosurgery, natural orifice trans-luminal endoscopic surgery, etc.). However, the shortcomings of today´s surgical tools fuel the need for the development of next-generation “smart instrumentation”, which will be more accurate and safer for the patient. This paper presents the preliminary results of a biologically inspired microtexturing method, based on UV-lithography, and its application to MI neurosurgery. These results suggest that the size and geometry of the texture “printed” on the outer surface of a neurosurgical probe clearly affect the insertion and extraction forces generated at the brain-probe interface. Thus, by carefully choosing an appropriate microtexture, unique insertion characteristics can be obtained, which can improve the performance of existing instruments (e.g. reducing slippage in permanent electrodes such as those used in deep brain stimulation) or enable the development of novel designs altogether.
  • Keywords
    Electrodes; Fuels; Geometry; Minimally invasive surgery; Neurosurgery; Orifices; Probes; Surface texture; Surface topography; Surgical instruments; Biomimetics; Electrodes, Implanted; Equipment Design; Equipment Failure Analysis; Needles; Neurosurgical Procedures; Surface Properties; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-1814-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2008.4650486
  • Filename
    4650486