DocumentCode :
3085525
Title :
Self-aligned III-V MOSFETs: Towards a CMOS compatible and manufacturable technology solution
Author :
Sun, Yue ; Majumdar, Angshul ; Cheng, C.-W. ; Kim, Young-Hun ; Rana, Uzma ; Martin, Roberto Martin ; Bruce, Robert L. ; Shiu, Kuen-Ting ; Zhu, Yujia ; Farmer, D. ; Hopstaken, Marinus ; Joseph, Eric A. ; de Souza, Joel P. ; Frank, Martin M. ; Cheng, S.-L.
Author_Institution :
Res. Div., T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
fYear :
2013
fDate :
9-11 Dec. 2013
Abstract :
We demonstrate self-aligned fully-depleted III-V MOSFETs using CMOS-compatible device structures and manufacturable process flows. Processes with good manufacturability and scalability, such as, gate definition and spacer formation using RIE, and formation of self-aligned source/drain extensions (SDE) and self-aligned raised source/drain (RSD), have been established on III-Vs. We demonstrate short-channel devices down to gate length LG = 30 nm. Our best short-channel devices exhibit peak saturation transconductance GMSAT = 1140 μS/μm at LG = 60 nm and supply voltage VDD = 0.5 V.
Keywords :
III-V semiconductors; MOSFET; CMOS compatible solution; CMOS-compatible device structures; gate definition; gate length; manufacturable process flows; manufacturable technology solution; peak saturation transconductance; self-aligned fully-depleted III-V MOSFET; self-aligned raised source/drain; self-aligned source/drain extensions; short-channel devices; size 30 nm; size 60 nm; spacer formation; voltage 0.5 V; Capacitance; Epitaxial growth; Logic gates; MOSFET; Resistance; Tin; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IEDM.2013.6724547
Filename :
6724547
Link To Document :
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