Title :
Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages
Author :
Ponchak, George E. ; Donghoon Chen ; Jong-Gwan Yook
Author_Institution :
NASA Lewis Res. Center, Cleveland, OH, USA
Abstract :
Reduced coupling between adjacent striplines in LTCC packages is commonly accomplished by walls made of plated via holes. In this paper, a 3D-FEM electromagnetic simulation of stripline with filled via fences on both sides is presented. It is shown that the radiation loss of the stripline and the coupling between striplines increases if the fence is placed too close to the stripline.
Keywords :
finite element analysis; packaging; strip line circuits; 3D FEM electromagnetic simulation; LTCC package; coupling; isolation; plated via hole fence; radiation loss; stripline circuit; Ceramics; Conducting materials; Costs; Coupling circuits; Dielectric losses; Distributed parameter circuits; Packaging; Radio frequency; Stripline; Strips;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.700838
