DocumentCode :
3085767
Title :
Se-passivated Si(100) surface for low and negative Schottky barriers
Author :
Tao, M. ; Udeshi, D. ; Agarwal, S. ; Kolappan, R. ; Xu, Y. ; Maldonado, E. ; Kirk, W.P.
Author_Institution :
NanoFAB Center, Texas Univ., Arlington, TX, USA
fYear :
2004
fDate :
15-16 March 2004
Firstpage :
119
Lastpage :
122
Abstract :
The Schottky barrier height at a metal/Si interface is ideally determined by the difference between metal work function and Si electron affinity for n-type Si. In reality, interface states between metal and Si pin the interface Fermi level, making the barrier height more or less independent of the ideal barrier height. We demonstrate that, by terminating dangling bonds on n-type Si(100) with a monolayer of Se, interface states are significantly reduced between metal and Si. As a result, low Schottky barriers are obtained for metals with low ideal barrier heights, such as Al and Cr. A negative Schottky barrier is demonstrated between Si and Ti, a metal commonly-used in the semiconductor industry. The negative Schottky barrier is thermally stable up to 400°C. For metals with high ideal barrier heights, inconsistency is observed between ideal barrier height and measured barrier height even with Se passivation.
Keywords :
Fermi level; Schottky barriers; annealing; dangling bonds; electron affinity; elemental semiconductors; interface states; passivation; selenium; semiconductor-metal boundaries; silicon; 400 degC; Al; Cr; Se-passivated Si(100) surface; Si; Si electron affinity; Ti; barrier height; ideal barrier height; interface Fermi level; interface states; low Schottky barriers; low ideal barrier heights; metal work function; monolayer; negative Schottky barriers; terminating dangling bonds; Annealing; Contact resistance; Electronics industry; Electrons; Interface states; Kirk field collapse effect; Molecular beam epitaxial growth; Passivation; Schottky barriers; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2004. IWJT '04. The Fourth International Workshop on
Print_ISBN :
0-7803-8191-2
Type :
conf
DOI :
10.1109/IWJT.2004.1306773
Filename :
1306773
Link To Document :
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