Title :
Wire-length distribution of three-dimensional integrated circuits
Author :
Nahman, A. ; Fan, Andy ; Chung, James ; Reif, Rafael
Author_Institution :
Microsystems Technol. Lab., MIT, Cambridge, MA, USA
Abstract :
In this paper, the wire (interconnect)-length distribution of three-dimensional (3D) integrated circuits is derived following the methodology used to estimate two-dimensional wire-length distribution (Davis et al, 1998). It is found that 3D integration results in a narrower wire-length distribution with a higher number of local wires and fewer global wires than 2D integration. The impact of 3D integration on system performance is discussed
Keywords :
VLSI; circuit CAD; circuit simulation; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; 2D integration; 2D wire-length distribution estimation methodology; 3D ICs; 3D integrated circuits; 3D integration; global wires; interconnect wire-length distribution; local wires; system performance; wire-length distribution; Delay; Integrated circuit interconnections; Integrated circuit technology; Logic circuits; Logic gates; Niobium; System performance; Three-dimensional integrated circuits; Very large scale integration; Wires;
Conference_Titel :
Interconnect Technology, 1999. IEEE International Conference
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5174-6
DOI :
10.1109/IITC.1999.787131
