Title :
I-V-T studies on ternary silicide Co1-xNixSi2/n-Si Schottky contacts
Author :
Zhu, Shiyang ; Ru, Guoping ; Qu, Xinping ; Van Meirhaeghe, R.L. ; Forment, S. ; Li, Bingzong
Author_Institution :
Dept. of Microelectron., Fudan Univ., Shanghai, China
Abstract :
Ternary silicide Co1-xNixSi2/n-Si(100) contacts with different x value were formed by solid phase reaction of Co/Ni bilayer and substrate Si. Their Schottky barrier properties were studied using the current voltage-temperature (I-V-T) measurements range from 100 to 300K. The I-V-T curves show three typical types, which can be related to the barrier height inhomogeneity. A clean trend is found that the barrier height inhomogeneity increases with increasing the annealing temperature. Ni incorporation reduces not only the silicidation temperature, but also the temperature at which the contact becomes inhomogeneity.
Keywords :
Schottky barriers; VLSI; annealing; cobalt compounds; elemental semiconductors; nickel compounds; silicon; 100 to 300 K; Co1-xNixSi2-Si; I-V-T studies; Schottky barrier; barrier height inhomogeneity; solid phase reaction; ternary silicide Co1-xNixSi2/N-Si Schottky contacts; Annealing; Conductivity; Current measurement; Electrical resistance measurement; Fabrication; Nickel; Schottky barriers; Silicides; Temperature distribution; Temperature measurement;
Conference_Titel :
Junction Technology, 2004. IWJT '04. The Fourth International Workshop on
Print_ISBN :
0-7803-8191-2
DOI :
10.1109/IWJT.2004.1306782