Title :
Electromigration early failure distribution in submicron interconnects
Author :
Gall, M. ; Ho, P.S. ; Capasso, C. ; Jawarani, D. ; Hernandez, R. ; Kawasaki, H.
Author_Institution :
Adv. Products Res. & Dev. Lab., Motorola Inc., Austin, TX, USA
Abstract :
The early failure issue in electromigration (EM) has been an unresolved subject of study over the last several decades. A satisfying experimental approach for the detection and analysis of early failures has not yet been established. In this study, a new technique utilizing large interconnect arrays in conjunction with the well-known Wheatstone bridge is presented. A total of more than 20,000 interconnects were tested. The results indicate that the EM failure mechanism studied here follows log-normal behaviour down to the 4 sigma level
Keywords :
arrays; electromigration; failure analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; log normal distribution; EM failure mechanism; Wheatstone bridge; early failure; early failure detection; electromigration; electromigration early failure distribution; interconnect arrays; interconnects; log-normal behaviour; Bridge circuits; Electrical resistance measurement; Electromigration; Failure analysis; Laboratories; Research and development; Resistors; Testing; Tin; Voltage;
Conference_Titel :
Interconnect Technology, 1999. IEEE International Conference
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5174-6
DOI :
10.1109/IITC.1999.787141
