Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper

Author

Brongersma, S.H. ; Vervoort, I. ; Judelwicz, M. ; Bender, H. ; Conard, T. ; Vandervorst, W. ; Beyer, G. ; Richard, E. ; Palmans, R. ; Lagrange, S. ; Maex, K.

Author_Institution

IMEC, Leuven, Belgium

fYear

1999

fDate

1999

Firstpage

290

Lastpage

292

Abstract

A study of the sheet resistance and stress of electrochemically deposited (ECD) blanket copper layers on a TaN barrier shows that the time dependence of these two parameters are not necessarily the same. This indicates that they are not simply interconnected through the grain size distribution changes occurring at room temperature. The plating bath composition and the resulting contaminant incorporation in the Cu layer during ECD has been identified as an additional important parameter in the explanation of the self-annealing behavior

Keywords

annealing; chemical interdiffusion; copper; diffusion barriers; electroplating; grain growth; grain size; integrated circuit interconnections; integrated circuit metallisation; internal stresses; recrystallisation; surface contamination; Cu layer; Cu-TaN; ECD; ECD blanket copper layers; TaN barrier; contaminant incorporation; electrochemically deposited blanket copper layers; electroplated copper; grain size distribution changes; parameter time dependence; plating bath composition; self-annealing; sheet resistance; stress; Copper; Electrical resistance measurement; Electromigration; Grain size; Lagrangian functions; Pollution measurement; Polymers; Stress; Substrates; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology, 1999. IEEE International Conference

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-5174-6

Type

conf

DOI

10.1109/IITC.1999.787147

Filename

787147