• DocumentCode
    3086369
  • Title

    Impact of nanowire variability on performance and reliability of gate-all-around III-V MOSFETs

  • Author

    Shin, S.H. ; Masuduzzaman, Muhammad ; Gu, J.J. ; Wahab, Muhammad Abdul ; Conrad, N. ; Si, M. ; Ye, Peide D. ; Alam, Md. Ashraful

  • Author_Institution
    Dept. of ECE, Purdue Univ., West Lafayette, IN, USA
  • fYear
    2013
  • fDate
    9-11 Dec. 2013
  • Abstract
    Gate-all-around (GAA) transistors use multiple parallel nanowires to achieve the desired ON current. The fabrication and performance of GAA transistors have been reported, however, a fundamental consideration, namely, the scaling and variability of transistor performance as a function of the number of parallel NWs is yet to be discussed. In this paper, we (i) examine how the overall performance matrix (e.g., ION, IOFF, Vth, SS, RC) depends on the number of parallel NWs, (ii) theoretically interpret the results in terms of variability and self-heating among the NWs, (iii) compare the reliability of multiple NW devices (ΔVth, ΔSS, both stress and recovery) with a planar device of similar technology. We find that the self-heating and NW-to-NW variability are reflected in novel properties of variability and reliability of GAA transistors that are neither anticipated nor observed in the corresponding planar technology.
  • Keywords
    III-V semiconductors; MOSFET; nanowires; semiconductor device reliability; GAA transistor reliability; GAA transistor variability; NW-to-NW variability; gate-all-around III-V MOSFET reliability; multiple-NW device reliability; nanowire variability; on current; overall performance matrix; parallel NW; parallel nanowires; planar device; planar technology; transistor performance scaling; transistor performance variability; Degradation; Indium gallium arsenide; Integrated circuit reliability; Logic gates; Stress; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2013 IEEE International
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/IEDM.2013.6724582
  • Filename
    6724582