DocumentCode :
3086665
Title :
2nd Generation dual-channel optimization with cSiGe for 22nm HP technology and beyond
Author :
Ortolland, C. ; Jaeger, David ; McArdle, T.J. ; DeWan, Charlotte ; Robison, R.R. ; Zhao, Kai ; Cai, Jinxin ; Chang, Peter ; Liu, Yanbing ; Varadarajan, V. ; Wang, Guibin ; Chou, A.I. ; Ioannou, Dimitris P. ; Oldiges, P. ; Agnello, P. ; Narasimha, S. ; Nar
Author_Institution :
IBM SRDC, Hopewell Junction, NY, USA
fYear :
2013
fDate :
9-11 Dec. 2013
Abstract :
In this paper we report on a comprehensive study of Silicon-Germanium channel (cSiGe) physics, layout effects and impact on device performance. This work demonstrates a 2nd generation of dual channel technology, which meets the 22nm high performance technology (HP) requirement. Modeling and simulation are used to optimize the process to obtain a 10% Short Channel Effect (SCE) improvement and an overall 20% performance enhancement. This 2nd generation high performance dual channel process has been integrated into a manufacturable and yieldable technology, thereby providing a solid platform for introduction of SiGe FinFet technology.
Keywords :
Ge-Si alloys; MOSFET; semiconductor device models; semiconductor materials; FinFet technology; HP technology; SCE; SiGe; crystalline silicon-germanium channel physics; high performance technology; second generation dual-channel optimization; short channel effect; size 22 nm; Junctions; Logic gates; Optimization; Performance evaluation; Random access memory; Silicon germanium; Strain;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IEDM.2013.6724594
Filename :
6724594
Link To Document :
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