DocumentCode :
3087137
Title :
Local transfer of single-crystalline silicon (100) layer by meniscus force and its application to high-performance MOSFET fabrication on glass substrate
Author :
Akazawa, M. ; Sakaike, K. ; Nakamura, Shigenari ; Higashi, Seiichiro
Author_Institution :
Grad. Sch. of Adv. Sci. of Matter, Hiroshima Univ., Higashi-hiroshima, Japan
fYear :
2013
fDate :
9-11 Dec. 2013
Abstract :
We propose a novel low-temperature layer transfer technique using meniscus force and midair cavity structure. Local transfer of thermally-oxidized SOI layer to glass was successfully carried out at 80 °C. N-channel MOSFET fabricated on glass using the SOI layer showed a very high field-effect mobility of 998 cm2V-1 S-1 and a low threshold voltage of 3.0 V. Single-crystalline silicon MOSFETs are successfully fabricated on glass under a maximum process temperature of 300 °C.
Keywords :
MOSFET; carrier mobility; elemental semiconductors; silicon; silicon-on-insulator; N-channel MOSFET; Si; field effect mobility; glass substrate; high-performance MOSFET; local transfer; low-temperature layer transfer; meniscus force; midair cavity structure; single-crystalline silicon (100) layer; single-crystalline silicon MOSFET; temperature 80 degC; thermally-oxidized SOI layer; voltage 3.0 V; Cavity resonators; Fabrication; Glass; MOSFET; Oxidation; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2013 IEEE International
Conference_Location :
Washington, DC
Type :
conf
DOI :
10.1109/IEDM.2013.6724612
Filename :
6724612
Link To Document :
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