Title :
A compact multichannel transceiver module using planar-processed optical waveguides and flip-chip optoelectronic components
Author :
Jackson, K.P. ; Flint, E.B. ; Cina, M.F. ; Lacey, D. ; Trewhella, J.M. ; Caulfield, T. ; Sibley, S.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The packaging concepts are compatible with existing high-speed, high-density electronic materials and processes and therefore have the potential for high-volume, low-cost manufacturing. The concepts are demonstrated using a four-channel transceiver module utilizing planar-processed optical waveguides and flip-chip optoelectronic components. An overview of the package is presented, and the substrate, the optoelectronic chip alignment, the module connector, and link tests are described
Keywords :
flip-chip devices; integrated optoelectronics; modules; optical communication equipment; optical waveguides; packaging; transceivers; chip alignment; flip-chip optoelectronic components; four-channel transceiver; link tests; low-cost manufacturing; module connector; multichannel transceiver module; planar-processed optical waveguides; planar-processed package; self-aligned optoelectronic components; Electronics packaging; High speed optical techniques; Manufacturing processes; Optical devices; Optical materials; Optical planar waveguides; Optical waveguide components; Optical waveguides; Planar waveguides; Transceivers;
Conference_Titel :
Electronic Components and Technology Conference, 1992. Proceedings., 42nd
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-0167-6
DOI :
10.1109/ECTC.1992.204190
