A compact multichannel transceiver module using planar-processed optical waveguides and flip-chip optoelectronic components

Author

Jackson, K.P. ; Flint, E.B. ; Cina, M.F. ; Lacey, D. ; Trewhella, J.M. ; Caulfield, T. ; Sibley, S.

Author_Institution

IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

1992

fDate

18-20 May 1992

Firstpage

93

Lastpage

97

Abstract

A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The packaging concepts are compatible with existing high-speed, high-density electronic materials and processes and therefore have the potential for high-volume, low-cost manufacturing. The concepts are demonstrated using a four-channel transceiver module utilizing planar-processed optical waveguides and flip-chip optoelectronic components. An overview of the package is presented, and the substrate, the optoelectronic chip alignment, the module connector, and link tests are described

Keywords

flip-chip devices; integrated optoelectronics; modules; optical communication equipment; optical waveguides; packaging; transceivers; chip alignment; flip-chip optoelectronic components; four-channel transceiver; link tests; low-cost manufacturing; module connector; multichannel transceiver module; planar-processed optical waveguides; planar-processed package; self-aligned optoelectronic components; Electronics packaging; High speed optical techniques; Manufacturing processes; Optical devices; Optical materials; Optical planar waveguides; Optical waveguide components; Optical waveguides; Planar waveguides; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1992. Proceedings., 42nd

Conference_Location

San Diego, CA

Print_ISBN

0-7803-0167-6

Type

conf

DOI

10.1109/ECTC.1992.204190

Filename

204190