Four-channel, long-wavelength transmitter arrays incorporating passive laser/singlemode-fiber alignment on silicon waferboard

Individually addressable, four-channel transmitter arrays operating at a wavelength of 1.3 μm have been developed based on a hybrid optoelectronic integration approach called silicon waferboard. This approach uses micromachined silicon substrates as a platform for integration of electronic, optoelectronic, and optical components. It should lead toward the development of optical multichip modules. Silicon waferboard uses mechanical alignment features fabricated on the surface of a silicon chip to permit passive optical alignment of components such as lasers and optical fibers. The transmitter array comprises a four-channel InGaAsP-InP laser array that is passively aligned to four single-mode fibers held in V-grooves. The transmitter array also includes a four-channel GaAs MESFET driver array chip that provides high-speed drive currents to the individual lasers. The laser array, driver array, and optical fibers are all spaced on 350-μm centers. which results ill a transmitter array that fits within a width of only 2 mm. Packages with high-speed electrical and optical I/Os have also been designed to accommodate the transmitter array waferboards for use in system applications